Advanced Semiconductor Enginee
Description Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. It offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; stacked die solutions in various package types, such as stacked die quad flat no-lead and hybrid BGAs containing stacked wire bond and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. The companys testing services include front-end test engineering testing, wafer probing, logic/mixed-signal/RF/discrete final testing services, memory final testing services, other test related services, and drop shipment services. It also offers electronics manufacturing services for use in a range of end-use applications, primarily computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan. To view the detailed information, you need to SUBSCRIBE with us. |
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